Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer

Product Details
Customization: Available
Application: Ceramic Decorations, Refractory, Structure Ceramic, Industrial Ceramic, Machinery, Electronic, Chemical, Petroleum etc.
Type: Ceramic Parts
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Number of Employees
50
Year of Establishment
2007-06-29
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
  • Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
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Basic Info.

Model NO.
AIN 016
Color
White/Gray
Category
Atomic Crystal
Chemical Formula
Ain
Boiling Point
2249
Weight
Customized
OEM/ODM
Available
Maximum Use Temperature
2000c
Thermal Conductivity
170-186W/M′k
Thermal Expansion Coefficient
3.2X10-6c
Lead Time
10 Days
Material
Aluminum Nitride Ceramic
Transport Package
Box/Carton / Plastic Bag / Wooden Case…
Specification
Customized
Trademark
Hard
Origin
Shenzhen, China
HS Code
6914900000
Production Capacity
100, 000PCS/Month

Product Description

cooling heat AIN aluminum nitride ceramic tablet shim wafer
Reputation depends on quality,  quality comes from Hard!

Aluminum Nitride Ceramics:
Aluminum nitride, a covalent bond compound, is an atomic crystal belonging to a diamond-like nitride, a hexagonal system, a wurtzite crystal structure, non-toxic, white or grayish white. The AIN crystal is a covalently bonded compound with a [AIN4] tetrahedron as a structural unit, and has a wurtzite structure and is a hexagonal system. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, single crystal colorless and transparent, sublimation decomposition temperature under normal pressure is 2450 °C. It is a high temperature heat resistant material. Thermal expansion coefficient (4.0-6.0) X10-6/°C. Polycrystalline AIN has a thermal conductivity of 260 W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat of 2200 °C. In addition, aluminum nitride is not attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.

Aluminum Nitride Ceramics properties:
(1) high thermal conductivity (about 170-186W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
(2) The coefficient of thermal expansion (4.5 × 10 -6 ° C) is matched with Si (3.5 ~ 4 × 10 -6 ° C) and GaAs (6 × 10 -6 ° C);
(3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
(5) high purity;
(6) good optical transmission characteristics;
(7) non-toxic;
(8) It can be produced by a casting process. It is a promising high-power integrated circuit substrate and packaging material.

Data Sheet


Properties of Aluminum Nitride Ceramics
Item Unit  Typical Values
Physical Properties
Color White Grey
Density g/cm3 3.3-3.4
Chemical Formula / AIN
Gas permeability 0
Water Absorption 0
Mechanical Properties
Moh's Hardness   5
Vickers hardness Gpa 11
Fracture Toughness KIC MPa•m1/2 2.6
Flexural Strength Mpa 466-496
Compressive Strength Mpa(lb/in2x103) 2100
Modulus of Elasticity(25°C) Gpa 320
Thermal Properties
Thermal Conductivity W/m·K 170-186
Thermal Expansion Coefficient 10-6/ºC 3.2-3.4
Thermal Shock Resistance T (ºC) 400
Specific Heat(25°C) J/kg.K 720
Maximum Use Temperature °C 2000
Electronic Properties
Dielectric Strength KV/mm 17-19
Dielectric Constant Er 8.8
Dielectric Loss Angle 1 MHz (×10-3) 0.3
Volume Resistivity(400~600ºC) Ω.cm 2.75*1014

Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Application :
1. Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.
2, aluminum nitride ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, small dielectric loss, is an ideal large-scale integrated circuit heat sink substrate and packaging materials.
3. Aluminum nitride has high hardness and exceeds traditional alumina. It is a new type of wear-resistant ceramic material, but it can only be used for severely worn parts due to its high cost.
4. Using AIN ceramics for heat resistance, melt erosion and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be fabricated, and its optical properties can be used as an infrared window. The aluminum nitride film can be made into a high frequency piezoelectric element, a very large scale integrated circuit substrate, or the like.
5, aluminum nitride heat-resistant, resistant to molten metal erosion, stable to acid, but easy to be eroded in alkaline solution. The AIN fresh surface is exposed to moist air and reacts to form a very thin oxide film. By utilizing this property, it can be used as a crucible and a die-casting mold material for smelting metals such as aluminum, copper, silver, and lead. AIN ceramics have good metallization properties and can be widely used in the electronics industry as an alternative to toxic cerium oxide.



Company Information

Shenzhen Hard Precision Ceramic CO.,Ltd founded in 2007, located in Shenzhen of China. We are a company that integrates development, design, moulding, sintering, production and sales of precision ceramic products. After 10 years of development, we have cooperated with more than 2000 customers and 60 universities; our factory covers an area of 2000 square meters, 50 employees, and annual production value of nearly 20 million. We have a higher visibility and better reputation in the same industry.

Compared with metals material, ceramic materials have excellent properties such as high hardness, high strength, high temperature(fire) resistance, wear resistance, corrosion resistance, acid and alkali resistance, oxidation resistance, insulation, nonmagnetic, good chemical stability and other excellent performance, so it is often used in the environment of the metal material is not up to. Advanced ceramics application prospect are very widely. It's widely used in aerospace, aviation, military industry, nuclear power, machinery, textile, chemical, electronic, food, medical, etc. We provide alumina ceramic, zirconia ceramic, silicon nitride (Si3N4) ceramic, macor (mica glass ) ceramic, aluminum nitride (AIN) ceramic, silicon carbide (SiC) ceramic, boron nitride (BN) ceramic, quartz ceramic, mullite ceramic, cordierite ceramic etc.

Our products include ceramic rods, ceramic tubes, ceramic pipes, ceramic plates, ceramic sheets, ceramic blocks, ceramic nozzles, ceramic plungers, ceramic washers, ceramic spacers, ceramic substrates and precision parts for industrial. We have all-line high precision equipment from ceramic forming, sintering to precision machining. Hope for a wide range of sincere cooperation with customers at domestic and abroad.

 

Why Choose Us?

1.12 years of professional production industrial ceramics factory
2.High quality products with low price
3.High precision parts with lowest tolerance
4.Short time for production 
5.Has a group of experienced, professional and efficient R&D team
6.Has a good reputation in China and abroad.
7.MOQ is not limited, small quantity is welcome.
8.Vigorous team and good after-sales service

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Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer


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Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer


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Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer



Our Team
Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer

FAQ

 

Q: Are you trading company or manufacturer ?
A: We are factory.

Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.

Q: What is your terms of payment ?

A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 50% T/T in advance ,balance before shippment.


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Cooling Heat Ain Aluminum Nitride Ceramic Tablet Shim Wafer

 

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